Hermetic microelectronic packages
, also often referred to as “hybrid packages
", are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions, including high temperature-, shock- and vibration-resistance. At the same time, the vacuum-tight housings and substrates must enable power and signal transmission (electrical and optical) into/ out of the package.
Hermetically sealed housings (including multi-pin MCM packages, IC packages, etc.) and microelectronic substrates
are essential to both protect and facilitate the reliable, long-term functionality of sensitive measurement or control electronics in a variety of harsh-environment applications:Your applications...
...our products: Multi-Pin MCM Packages - Hermetic IC Packages - Microwave Packages - Amplifier Packages - RF Packages - Power Packages with high thermal conductivity - Fine-Pitch HTCC Substrates and Circuit Boards - Dewar Flanges - TO headers and caps -
- Defense, Aviation and Aerospace applications: microwave power amplification in aerospace communication, e-Scan radar (TRM transmit and receive modules, microwave and power supply systems), laser warning receivers, cooled IR detection, uncooled IR detection or high-temperature sensors, and more
- Industrial applications, including sensors, geotectonics, measurement equipment, chemical engineering equipment, and more
- Oil & Gas applications, for example Wireline and MWD electronics (MWD: measure while drilling) Electronics (motor controllers), and more
- Medical electronics, including medical treatment and diagnosis systems, and more.
and many more.