3D Plus SAS

408, rue Hélène Boucher, 78532 Buc

Telephone +33 1 30832650
Fax +33 1 39562589


Hall map

COMPAMED 2016 hall map (Hall 8a): stand R09

Fairground map

COMPAMED 2016 fairground map: Hall 8a

Our range of products

Product categories

  • 01  Components, parts, modules, Original Equipment Manufacturers
  • 01.17  Endoscope parts

Endoscope parts

Our products

Product category: Endoscope parts

Medical & Sciences

The fantastic development of the components interconnection technology allowed imagining « Systems in Package » of around a few mm3, which opened new perspectives for medical and sciences applications.

Since the use of hybrid modules, then Multichip Modules « MCM » which were identical to the previous ones but named differently, the coming of the interconnection in 3-D allowed to divide both the volume and weight of a module by a factor comprised between 25 and more than 100.

Key benefits
3D PLUS State-of-the-Art stacking technology and recognized design, manufacturing and test expertise realize key features and benefits for medical and science applications:

• Extreme miniaturization

• Capability to merge heterogeneous component technologies (Die-Package-Passive) and functions (sensor, stimulators, communication, processing, storage, energy) in one single Package

• Very high performance (no parasitic elements between sensors and processing electronics)

• Very High Reliability

• Rugged to harsh environments

Application fields

• Flexible Endoscope and minimally invasive probes (medical and veterinary)

• X-Ray Camera (medical and science)

• Ultrasonic echography

• Leadless pacemakers and implantable cardioverter defibrillator

• Micro stimulators and implantable devices

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About us

Company details

3D PLUS is a recognized supplier in the medical industry, providing highly miniaturized electronic microsystems, for the following domains:

• Endoscopes and minimally invasive probes
• Leadless pacemakers and implantable cardioverter defibrillators
• Micro fluid control
• Health monitoring implants

By integrating electronics of different kinds in 3D, the 3D PLUS modules are allowing unprecedented scales while maintaining a high level of reliability.

This year at COMPAMED, 3D PLUS will introduce a new micro camera system for video endoscopes, based on CMOS sensor technology, fitting into the same form factor as the traditional CCD products.
Along with the image sensor, the camera head module does integrate real time image processing functions such as brightness, color accuracy, contrast and video resolution adjustment, outputting a stream of images ready for display.
It can be delivered as a full OEM video system accommodating various cable lengths.
We look forward to seeing you at our booth 8AR09.

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Company data

Sales volume

10-49 Mio US $

Export content

> 75%

Number of employees